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Effects of a Bi/sub 4/Ti/sub 3/O/sub 12/ buffer layer on SrBi/sub 2/Ta/sub 2/O/sub 9/ thin films prepared by the metal organic solution deposition technique

机译:Bi / sub 4 / Ti / sub 3 / O / sub 12 /缓冲层对通过金属有机溶液沉积技术制备的SrBi / sub 2 / Ta / sub 2 / O / sub 9 /薄膜的影响

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Ferroelectric SrBi/sub 2/Ta/sub 2/O/sub 9/ (SBT) thin films with 20 mol% excess Bi content have been deposited on the Bi/sub 4/Ti/sub 3/O/sub 12/ (BTO) buffered Pt/Ti/SiO/sub 2//Si substrates using the metal organic solution deposition (MOSD) technique at annealing temperatures ranging from 650/spl deg/C to 750/spl deg/C. The BTO single buffer layer with different excess Bi content (0 mol%, 20 mol% and 40 mol%) was prepared by the same deposition method. No pyrochlore phase was found in the SBT thin films although the Bi/sub 2/Ti/sub 2/O/sub 7/ phase appeared in the BTO buffer layer. The effects of the BTO buffer layer and post annealing temperature on the dielectric and ferroelectric properties of SBT thin films were analyzed.
机译:Bi / sub 4 / Ti / sub 3 / O / sub 12 /(BTO)上沉积了Bi含量超过20 mol%的铁电SrBi / sub 2 / Ta / sub 2 / O / sub 9 /(SBT)薄膜使用金属有机溶液沉积(MOSD)技术在650 / spl deg / C至750 / spl deg / C的退火温度下缓冲Pt / Ti / SiO / sub 2 // Si衬底。通过相同的沉积方法制备具有不同的过量Bi含量(0mol%,20mol%和40mol%)的BTO单缓冲层。尽管在BTO缓冲层中出现了Bi / sub 2 / Ti / sub 2 / O / sub 7 /相,但在SBT薄膜中未发现烧绿石相。分析了BTO缓冲层和退火后温度对SBT薄膜介电和铁电性能的影响。

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