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Surface Treatment Of Copper Inner-layer With Electroless Copper Plating Using Hypophosphite As A Reducing Agent

机译：次磷酸盐作为还原剂的化学镀铜对铜内层的表面处理

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《》|2001年|P.234-239|共6页
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Fujinami; T.; Honma; H.;
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中图分类无线电电子学、电信技术;
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1. Influence of N-N dimethyl formamide on electroless copper plating using hypophosphite as reducing agent [J] . T. Anik, A. EL Haloui, M. Ebn Touhami, Surface & Coatings Technology . 2014,第Null期

机译：N-N二甲基甲酰胺对以次磷酸盐为还原剂的化学镀铜的影响
2. Influence of pH Solution on Electroless Copper Plating Using Sodium Hypophosphite as Reducing Agent [J] . T. Anik, M. Ebn Touhami, K. Himm, International Journal of Electrochemical Science . 2012,第3期

机译：pH溶液对次磷酸钠还原剂化学镀铜的影响
3. Role of additives in electroless copper plating using hypophosphite as reducing agent [J] . Gan X., Zhou K., Hu W., Surface & Coatings Technology . 2012,第15期

机译：添加剂在以次磷酸盐为还原剂的化学镀铜中的作用
4. Surface Treatment Of Copper Inner-layer With Electroless Copper Plating Using Hypophosphite As A Reducing Agent [C] . Fujinami T., Honma H., Institute of Electric and Electronic Engineer Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference . 2001

机译：用次磷酸盐作为还原剂的化学镀铜铜内层表面处理
5. Electroless copper plating on graphite/epoxy and graphite/cyanate ester laminates. [D] . Xu, Hong. 1998

机译：在石墨/环氧树脂和石墨/氰酸酯层压板上进行化学镀铜。
6. Laser-Induced Silver Seeding on Filter Paper for Selective Electroless Copper Plating [O] . Chang-Chun Liu, Jin Cheng, Xiao-Qiang Li, 2018

机译：用于选择性化学镀铜的滤纸上激光诱导的银种子
7. Microstructure of Reduced Ni Films on Copper Substrate from Electroless Plating Bath Containing NaBH4 as Reducing Agent [O] . Yoshimi TANABE, Tohru WATANABE 1972

机译：含有NaBH4含有NaBH4的铜基材上的铜基材的镍膜的微观结构
8. Atmospheric Releases of Formaldehyde from Electroless Copper Plating Operations [R] . Cooper, C. D., Wayson, R. L., Dietz, J. D., 1993

机译：化学镀铜操作中甲醛的大气释放

Surface Treatment Of Copper Inner-layer With Electroless Copper Plating Using Hypophosphite As A Reducing Agent

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