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A study of microwave curing process for underfill used in flip chip packaging. part 2: 3D FEM simulation of microwave power distribution inside variable frequency microwave oven

机译：倒装芯片封装中底部填充剂的微波固化工艺研究。第2部分：变频微波炉内微波功率分布的3D有限元模拟

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来源
《》|2001年|P.29-33|共5页
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作者
Sung Yi; Lie Liu; Chian Kerm Siu;
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中图分类无线电电子学、电信技术;
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专利

1. Void-Free Underfill Process With Variable Frequency Microwave for Higher Throughput in Large Flip Chip Package Application [J] . Diop Mamadou Diobet, Paquet Marie-Claude, Danovitch David, Device and Materials Reliability, IEEE Transactions on . 2015,第2期

机译：大型倒装芯片封装应用中具有更高频率的无空隙微波变频底部填充工艺
2. Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging [J] . Lie Liu, Sung Yi, Lin Seng Ong, IEEE transactions on electronics packaging manufacturing . 2005,第4期

机译：倒装芯片封装中底部填充物微波固化过程的化学热建模和有限元分析
3. Finite element analysis for microwave cure of underfill in flip chip packaging [J] . Lie Liu, Sung Yi, Lin Seng Ong, Thin Solid Films . 2004,第Sep期

机译：倒装芯片封装中底部填充物微波固化的有限元分析
4. A study of microwave curing process for underfill used in flip chip packaging. part 2: 3D FEM simulation of microwave power distribution inside variable frequency microwave oven [C] . Sung Yi, Lie Liu, Chian Kerm Siu . 2001

机译：倒装芯片封装中底部填充剂的微波固化工艺研究。第2部分：变频微波炉内微波功率分布的3D有限元模拟
5. A Study of Microwave Curing of Underfill using Open and Closed Microwave Ovens [D] . Thakare, Aditya. 2015

机译：用开放式和封闭式微波炉对底部填充料进行微波固化的研究
6. Comparative evaluation of diametral tensile strength of phosphate-bonded investment (ringless) material by using air-drying method conventional hot air oven microwave oven and combination of microwave and conventional oven: An in vitro study [O] . Akhil Rathi, Neelam Pande, Usha Radke, 2019

机译：使用空气干燥法常规热空气烘箱微波炉和微波和常规烤箱组合的磷酸盐 - 粘结投资（无虹压）材料直径抗拉强度的比较评价：体外研究
7. A Study of Microwave curing of Underfill using Open and Closed microwave ovens [O] . Thakare Aditya 2015

机译：微波炉开放式微波炉微波固化研究
8. Variable frequency microwave (VFM) curing, processing of thermoset prepreg laminates. Final report [R] . Paulauskas, F. L. 1996

机译：变频微波（VFm）固化，热固性预浸料层压板的加工。总结报告

A study of microwave curing process for underfill used in flip chip packaging. part 2: 3D FEM simulation of microwave power distribution inside variable frequency microwave oven

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