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Experimental Analytical Study Of Fine Pitch Qfp Solder-joint Reliability

机译：细间距Qfp焊点可靠性的实验分析研究

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来源
《》|2001年|P.181-182|共2页
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Kojima; Y.; Sakiura; J.;
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中图分类无线电电子学、电信技术;
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机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
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8. Reliability-based structural optimization: A proposed analytical-experimental study [R] . Stroud, W. Jefferson, Nikolaidis, Efstratios 1993

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Experimental Analytical Study Of Fine Pitch Qfp Solder-joint Reliability

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