RF MEMS technology shows great promise for wireless communication and other RF applications. However, the packaging of RF MEMS devices becomes one of the most important issues in MEMS device fabrication and presents challenges due to the unique requirements. Special precautions are not only required to allow assembly processes after releasing the delicate structures but also to ensure the structures to operate in a stable atmosphere during its entire lifetime. These requirements come on top of the other well-known requirements for cell phone components: cost, size and height. NXP Semiconductors has developed an efficient packaging technology for RF-MEMS devices in close cooperation with the Fraunhofer Institute in Itzehoe (ISiT). This paper presents a summary of several major aspects of our development activities in order to generate this new packaging technology.
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