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New single-poly EEPROM with cell size down to 8F/sup 2/ for high density embedded nonvolatile memory applications

机译:新型单多晶硅EEPROM,单元尺寸低至8F / sup 2 /,适用于高密度嵌入式非易失性存储器应用

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摘要

A novel EEPROM memory cell with new program and erase operations fabricated by standard CMOS logic process is presented. The cell which consists of two N-Type MOSFET transistors in series is programmed by select gate controlled channel hot hole and erased by channel hot electron injection along with more than 10/sup 5/ cycles of endurance and 1000 hours of data retention at 150/spl deg/C. Without an additional P-well or N-well serving as the coupling gate, the area of a bit can be as small as 8F/sup 2/, the smallest area reported for single-poly EEPROM cells.
机译:提出了一种具有标准CMOS逻辑工艺制造的具有新编程和擦除操作的新型EEPROM存储单元。该单元由两个串联的N型MOSFET晶体管组成,可通过选择栅极控制的沟道热孔进行编程,并通过沟道热电子注入进行擦除,并具有超过10 / sup 5 /的耐久性和在150 /升/摄氏度如果没有额外的P阱或N阱用作耦合门,则位的面积可以小至8F / sup 2 /,这是单多晶硅EEPROM单元报告的最小面积。

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