A 7F/sup 2/ DRAM cell and corresponding vertically folded bitline architecture has been fabricated using a 0.175 /spl mu/m CMOS technology. This concept features an advanced 30/spl deg/ tilted array device layout and an area penalty free inter BL twist. The presented scheme minimizes local well noise by maximizing the number of twisting intervals.
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机译:7F / sup 2 / DRAM单元和相应的垂直折叠位线架构已使用0.175 / spl mu / m CMOS技术制造。该概念具有先进的30 / spl度/倾斜阵列器件布局和无BL扭曲区域。所提出的方案通过最大化扭曲间隔的数量来最小化局部阱噪声。
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