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Modeling and layout optimization of VLSI devices and interconnects in deep submicron design

机译:在深亚微米设计中对VLSI器件和互连进行建模和布局优化

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This paper presents an overview of recent advances on modeling and layout optimization of devices and interconnects for high-performance VLSI circuit design under the deep submicron technology. First, we review a number of interconnect and driver/gate delay models, which are most useful to guide the layout optimization. Then, we summarize the available performance optimization techniques for VLSI device and interconnect layout, including driver and transistor sizing, transistor ordering, interconnect topology optimization, optimal wire sizing, optimal buffer placement, and simultaneous topology construction, buffer insertion, buffer and wire sizing. The efficiency and impact of these techniques will be discussed in the tutorial.
机译:本文概述了在深亚微米技术下用于高性能VLSI电路设计的器件和互连的建模和布局优化的最新进展。首先,我们回顾一些互连和驱动器/栅极延迟模型,它们对于指导布局优化最有用。然后,我们总结了适用于VLSI器件和互连布局的性能优化技术,包括驱动器和晶体管的尺寸确定,晶体管订购,互连拓扑优化,最佳的导线尺寸,最佳的缓冲区放置以及同时的拓扑构造,缓冲区插入,缓冲区和导线尺寸。这些技术的效率和影响将在本教程中讨论。

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