In semiconductor manufacturing processes, surface contamination is a very important issue because it decreases the product yield of the LSI. In this study, a new method to remove fine airborne particles and gaseous contaminants in the wafer stocker using a UV/photoelectron method has been investigated. Two kinds of wafer stockers are used for investigating the efficiency of the UV/photoelectron method for controlling (1) particulate and gaseous contaminants under atmospheric conditions and (2) particulate contaminants under low pressure conditions.
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