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Future directions in controlling particle contamination in semiconductor integrated circuit manufacturing: an industry survey

机译:半导体集成电路制造中控制颗粒污染的未来方向:行业调查

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Rapid progress in integrated circuit technology and the rising cost of wafer fabrication makes contamination control a critical issue in the semiconductor industry. This paper describes the results of an international survey of 750 contamination control specialists in the semiconductor fabrication and equipment industry. The purpose of the survey is to assess (1) the current problems in sub-micron IC manufacturing; (2) emerging technologies to deal with these problems; and (3) the potential of new solutions, such as minienvironments, to emerge as a significant alternative approach to conventional cleanrooms. The latter question is of particular interest. The survey examines current opinion on minienvironments and identifies the major obstacles toward the adoption and implementation of the standard mechanical interface (SMIF).
机译:集成电路技术的飞速发展和晶片制造成本的上升使得污染控制成为半导体工业中的关键问题。本文描述了对750名半导体制造和设备行业的污染控制专家进行的国际调查的结果。该调查的目的是评估(1)亚微米IC制造中的当前问题; (2)解决这些问题的新兴技术; (3)诸如小型环境之类的新解决方案有可能成为传统洁净室的重要替代方法。后一个问题特别令人关注。该调查研究了有关小型环境的当前意见,并确定了采用和实施标准机械接口(SMIF)的主要障碍。

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