A device characterization technique using per-die test structures for mixed-signal integrated circuits

摘要

The authors present a characterization methodology using per-die test structures to address the need for accurate and reliable product-process models for mixed-signal IC designs. These product-process relationships are critical in generating guardbands and forecasting production yields based on predicted product performance across process variations. Guardband generation, the per-die test structures, and the product-process transformation for analog and digital circuits are discussed.