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Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas

机译:在真空和惰性气体中与纳米晶金属薄膜的原子扩散键合

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摘要

Atomic diffusion bonding (ADB) of two flat wafers in an inert gas with thin metal films was studied. Its performance was compared to that of ADB “in vacuum.” Results suggest that ADB can be conducted in Ar gas using almost any metal film, as is true also for bonding in vacuum.
机译:研究了在惰性气体中具有金属薄膜的两个扁平晶片的原子扩散键合(ADB)。在真空中将其性能与亚行的性能进行了比较。结果表明,几乎可以使用任何金属膜在Ar气中进行ADB,对于真空键合也是如此。

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