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Identification of Logic Paths Influenced by Severe Coupling Capacitances

机译:识别受严重耦合电容影响的逻辑路径

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Modern integrated circuits present complex interconnect structures, in which the signal coupling play an important role in the overall circuit behavior. In this paper, a method to identify those logic paths more significantly influenced by signals at coupled lines is presented. This method can be used to validate circuit behavior and can also be applied in testing techniques oriented to detect interconnect defects (e.g. opens and short defects). A modified Dijkstra's algorithm is used to find those paths between a primary input and a primary output with higher coupling capacitances. This methodology is applied to ISCAS'85 benchmark circuits.
机译:现代集成电路具有复杂的互连结构,其中信号耦合在整个电路性能中起着重要的作用。在本文中,提出了一种方法来识别那些受到耦合线信号影响更大的逻辑路径。该方法可用于验证电路行为,也可用于旨在检测互连缺陷(例如,开路和短路缺陷)的测试技术。修改后的Dijkstra算法用于查找具有较高耦合电容的初级输入和初级输出之间的路径。该方法适用于ISCAS'85基准电路。

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