Topside Defect Localization Using OBIRCH Analysis

机译：使用OBIRCH分析进行顶部缺陷定位

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OBIRCH analysis is a useful technique for defect localization not only for parametric failures, but also for functional analysis. However, OBIRCH results do not always identify the exact defect location. OBIRCH analysis results must be used in conjunction with other analysis tools and techniques to successfully identify defect locations.

机译：OBIRCH分析不仅对于参数故障，而且对于功能分析，都是用于缺陷定位的有用技术。但是，OBIRCH结果并不总是能识别出确切的缺陷位置。 OBIRCH分析结果必须与其他分析工具和技术结合使用，以成功识别缺陷位置。

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来源
《International Symposium for Testing and Failure Analysis(ISTFA 2004); 20051106-10; San Jose,CA(US)》|2005年|P.95-100|共6页
会议地点 San JoseCA(US)
作者
Clifford Howard; Anusha Weerakoon; Diana Mitro; Dawn Glaeser;
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作者单位

Freescale Semiconductor, Inc., 6501 William Cannon Dr. West, Austin, Texas 78735 U.S.A.;

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原文格式 PDF
正文语种 eng
中图分类 TN304.07;
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Topside Defect Localization Using OBIRCH Analysis

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