Corrosion Failure and its Countermeasure of Kovar Leads in Microelectronic Packages

摘要

In this paper the corrosion failure mechanism of Kovar leads in microelectronic packages is discussed. It is believed that the anodic dissolution and the cathodic hydrogen evolution which occur at the occluded zone in gold plating defects must be responsible for the corrosion failure. Improving sealing quality at lead-to-glass interface, eliminating chloride ions technology and choosing nickel plating with low stress etc are proposed to reduce the corrosion failure of leads in microelectronic packages.