HIGH THERMALLY CONDUCTIVE UNDERFILL FOR FLIP-CHIP APPLICATIONS

摘要

High thermally conductive underfill has been developed. It is filled with fine particle size aluminum nitride that will provide high thermal conductivity and good fluidity. Also, this product satisfies the basic requirements for the underfill, such as the Level 3 JEDEC preconditioning test. This paper presents work in developing an approach to underfill material for flip-chip package by using an aluminum nitride.