【24h】

Temperature stability of p-n CdxHg1-xTe structures formed by ion beam milling

机译:离子束铣削形成的p-n CdxHg1-xTe结构的温度稳定性

获取原文
获取原文并翻译 | 示例

摘要

Abstract: The influence of thermal annealing on electrical properties of p-n structures formed by ion beam milling (IBM) on vacancy doped Cd$-x$/Hg$-1$MIN@x$/Te (x $EQ 0.205) single crystals with p (77 K) $EQ 5.8$DOT@10$+15$/ cm$+$MIN@3$/ was investigated. After IBM of the initial samples the n-type layers were created with the thickness about 10 $mu and electron concentration of the main part of n-type layers 5$DOT@10$+14$/ cm$+$MIN@3$/. P-n structures were annealed in air at 85, 120 and 160$DGR@C during 1, 2, and 4 hours. Degradation of the p-n structure after every annealing step was estimated on changes of the Hall coefficient dependence of magnetic field. It was revealed that degradation of the p-n structure took place due to progressive thickness decreasing of n-layer through Hg passing to intersites and vacancy creation. The critical temperature during technology steps is equal about 100$DGR@C.!8
机译:摘要:热退火对离子束铣削(IBM)形成的pn结构的电性能对空位掺杂Cd $ -x $ / Hg $ -1 $ MIN @ x $ / Te(x $ EQ 0.205)单晶的影响p(77 K)$ EQ 5.8$DOT@10$+15$/ cm $ + $ MIN @ 3 $ /被调查。在初始样品的IBM之后,创建了n型层,其厚度约为10μmu,n型层主要部分的电子浓度为5 $ DOT @ 10 $ + 14 $ / cm $ + $ MIN @ 3 $ /。在1、2和4个小时内,将P-n结构在85、120和160 $ DGR @ C的空气中退火。根据磁场的霍尔系数依赖性的变化,估计每个退火步骤后p-n结构的降解。结果表明,p-n结构的退化是由于通过Hg传递到位点和空位的产生使n层厚度逐渐减小所致。技术步骤中的临界温度大约等于100$DGR@C.!8

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号