首页> 外文会议>International Conference on Single Crystal Growth and Heat amp; Mass Transfer(ICSC-2003) vol.1; 20030922-26; Obninsk(RU) >NEW APPROACHES TO AUTOMATED CONTROL SYSTEM DESIGN FOR CZ SINGLE CRYSTALS GROWTH WITH DIAMETER 200-300 MM
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NEW APPROACHES TO AUTOMATED CONTROL SYSTEM DESIGN FOR CZ SINGLE CRYSTALS GROWTH WITH DIAMETER 200-300 MM

机译:直径200-300 MM的CZ单晶生长自动控制系统设计的新方法

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Production of the modern extra-large and sophisticated integral schemes demands strict structural perfection of silicon single crystals grown by Czochralski pulling method. Possibility to growing ingot diameter increasing and realization of visible opportunities to obtain electro- physical parameters stability determine this method implementation. Modem integral schemes require single crystal Si with low concentration of microdefects and with stated oxygen concentration as well as dislocation-free. The crystals under investigation presented two kinds of microdefects different in both, concentration and size. A-defects are the microdefects of large size inside an ingot or a wafer. B-defects are the microdefects of smaller size distributing through the crystal up to the crystal surface. Pulling speed Vs plays essential role in point defects condensation in grown Si single crystal. Pulling speed causes changes in grown Si single crystal temperatures. As a result of that there is no time for defects to undergo hardening thus forming microdefects A, A′, B, α types. The production of such material is impossible without modern control systems implementation necessary for single crystal growth using mathematical models of physical processes based on Czochralski method. As stated in [3], the choice of methods of modeling and single crystal growth technological process optimization is determined by certain peculiarities of this process: great number of parameters, including uncontrolled ones; wide ranges of controlled parameters variations; stochastic variability of environment; high level noise fields.
机译:现代超大型和复杂积分方案的生产要求通过切克劳斯基拉法生长的硅单晶具有严格的结构完善性。增大晶锭直径的可能性以及实现获得电物理参数稳定性的可见机会的可能性决定了该方法的实现。现代积分方案要求具有低浓度的微缺陷,具有规定的氧浓度以及无位错的单晶硅。被研究的晶体表现出两种微观缺陷,它们的浓度和大小都不同。 A缺陷是晶锭或晶圆内部较大尺寸的微缺陷。 B缺陷是较小尺寸的微缺陷,其通过晶体分布直至晶体表面。提拉速度Vs在生长的Si单晶中的点缺陷凝结中起着至关重要的作用。提拉速度导致生长的Si单晶温度发生变化。结果,没有时间使缺陷硬化从而形成微缺陷A,A',B,α型。如果没有使用基于Czochralski方法的物理过程数学模型的单晶生长所必需的现代控制系统,则无法生产这种材料。如[3]所述,建模和单晶生长工艺过程优化的方法选择取决于该过程的某些特性:大量参数,包括不受控制的参数;各种受控参数变化;环境的随机变化;高电平噪声场。

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