首页> 外文会议>International Conference on Silicon Carbide and Related Materials 2003 pt.2(ICSCRM 2003); 20031005-20031010; Lyon; FR >Fabrication of mesa-type pn diodes without forward degradation on ultara-high-quality 6H-SiC substrate
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Fabrication of mesa-type pn diodes without forward degradation on ultara-high-quality 6H-SiC substrate

机译:在超高质量6H-SiC衬底上制造不会正向退化的台面型pn二极管

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摘要

Using our own substrate growth and epitaxial growth techniques, we fabricated a 1.4 kV mesa-type 6H-SiC pn diode with an ideal avalanche breakdown and without forward degradation. The 6H-SiC substrates were grown on Lely crystals with no micropipes and only minimal defects. A pn junction was fabricated by chemical vapor deposition (CVD) with p~+~- epitaxial films. We obtained 1.4 kV breakdown voltage, consistent with the ideal breakdown voltage calculated from the thickness (10μm) and doping concentration (2xl0~(16)cm~(-3)) of the drift layer. The application of 200 A/cm~2 current stress in the forward direction produced no degradation, which is often observed with pn diodes on normal commercial substrates.
机译:使用我们自己的衬底生长和外延生长技术,我们制造了一个1.4 kV台面型6H-SiC pn二极管,该二极管具有理想的雪崩击穿特性,并且没有正向退化。 6H-SiC衬底生长在Lely晶体上,没有微管,只有很少的缺陷。通过化学气相沉积(CVD)用p〜+ / n〜-外延膜制造pn结。我们获得了1.4 kV的击穿电压,该电压与根据漂移层的厚度(10μm)和掺杂浓度(2xl0〜(16)cm〜(-3))计算出的理想击穿电压一致。在正向施加200 A / cm〜2的电流应力不会产生退化,这在普通商用基板上的pn二极管中经常观察到。

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