首页> 外文会议>International Conference on Precision Engineering and Micro/Nano Technology in Asia; 20051112-14; Shenzhen(CN) >Research on Influence of the Cutter Rake Angle to the Surface Quality during SPDT Machining of Crystal KDP
【24h】

Research on Influence of the Cutter Rake Angle to the Surface Quality during SPDT Machining of Crystal KDP

机译:晶体KDP SPDT加工时刀具前角对表面质量的影响研究

获取原文
获取原文并翻译 | 示例

摘要

Influence of the cutter rake angle to the surface quality of crystal KDP is analyzed theoretically in this paper. Analysis result shows that the tension stress reaches minimum in the crystal KDP cutting region and optimal value of the surface quality is obtained as cutter rake angle is about -45°. Cutting experimental of different cutter rake angle is realized on the machine tool. Experimental results show that the surface roughness of the crystal KDP reach minimum (rms is 6.521 nm, Ra is 5.151nm) as the cutter rake angle is about -45°, this experiment certifies the correctness of this theory analysis. Theory analysis and experimental results show that influence of the cutter rake angle to surface quality of the crystal KDP is very large, for ultra-precision machining of the crystal KDP, when large negative rake diamond cutter (-45°) is adopted, the super-smooth surface can be obtained.
机译:从理论上分析了刀具前角对晶体KDP表面质量的影响。分析结果表明,当刀具前角约为-45°时,在晶体KDP切削区域中拉应力达到最小,并且获得了表面质量的最佳值。在机床上实现了不同刀具前角的切削实验。实验结果表明,当刀具前角约为-45°时,晶体KDP的表面粗糙度达到最小(均方根值为6.521 nm,Ra为5.151nm),证明了该理论分析的正确性。理论分析和实验结果表明,刀具前角对晶体KDP表面质量的影响非常大,对于晶体KDP的超精密加工,当采用大型负前角金刚石刀具(-45°)时,超级-可以获得光滑的表面。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号