首页> 外文会议>International Conference on Molecular Beam Epitaxy, 11th, Sep 11-15, 2000, Beijing, China >GSMBE grown In_(0.49)Ga_90.51)P/GaAs heterojunction bipolar transistors with heavily beryllium doped base and undoped Spacer
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GSMBE grown In_(0.49)Ga_90.51)P/GaAs heterojunction bipolar transistors with heavily beryllium doped base and undoped Spacer

机译:GSMBE生长的In_(0.49)Ga_90.51)P / GaAs异质结双极晶体管,带有重掺杂铍的基极和未掺杂的垫片

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摘要

Lattice-matched N-p~+-n In_(0.49)Ga_(0.51)P/GaAs heterojunction bipolar transistors (HBT's) with heavily beryllium doped base and undoped spacers were grown by gas source molecular beam epitaxy (GSMBE). The epitaxial structure consists of, from the bottom to the top, a 5000 A n ~+ -GaAs sub-collector with Si doping level of 3 x 10~(18)cm~(-3), a 7000A n-GaAs collector doped at concentration of 3 x 10~(16)cm~(-3), a 60nm p ~+ -GaAs base with Be doping level up to 3 x l0~(19)cm~(-3) inserted between two undoped GaAs spacers, a 100nm N-In_90.49)Ga_(0.51)P emitter doped at 3 x 10~(17)cm~(-3), The structure was completed with a 150nm n~+ -GaAs cap layer with Si doping level of 3 x 10~(18)cm~(-3). Devices with emitter area of 100 x 100 μm were fabricated on the grown wafer by using selective wet chemical etching technique and photolithographic process. AuGeNi/Au was used for the emitter and collector contacts, and Cr/Au was used for the base contact. The turn-on voltages of p~+ -GaAs/N-In_(0.49)Ga_(0.51)P heterojunction and p ~+ -GaAs-GaAs junction are 1.0 and 0.65 V. The reverse breakdown voltages of the B-E and B-C junctions are 10 and 12V. The common-emitter current-voltage characteristics show that the maximum current gain reaches 320 at the collector current of 90mA.
机译:通过气源分子束外延生长法(GSMBE),生长出晶格匹配的N-p〜+ -n In_(0.49)Ga_(0.51)P / GaAs异质结双极晶体管(HBT),其中掺有铍的基极和未掺杂的隔离物。外延结构从下到上由一个5000 A n〜+ -GaAs子集电极和一个7000A n-GaAs集电极组成,该子集电极的Si掺杂水平为3 x 10〜(18)cm〜(-3)。在浓度为3 x 10〜(16)cm〜(-3)的情况下,在两个未掺杂的GaAs间隔层之间插入60nm p〜+ -GaAs碱,其Be掺杂水平高达3 x l0〜(19)cm〜(-3)。 ,以3 x 10〜(17)cm〜(-3)掺杂的100nm N-In_90.49)Ga_(0.51)P发射极,用150nm n〜+ -GaAs盖层完成了结构,Si掺杂水平为3 x 10〜(18)cm〜(-3)通过使用选择性湿法化学蚀刻技术和光刻工艺,在生长的晶片上制造出发射器面积为100 x 100μm的器件。 AuGeNi / Au用于发射极和集电极触点,而Cr / Au用于基极触点。 p〜+ -GaAs / N-In_(0.49)Ga_(0.51)P异质结和p〜+ -GaAs / n-GaAs结的开启电压分别为1.0和0.65V。BE和BC的反向击穿电压结点是10V和12V。共射极电流-电压特性表明,在90mA的集电极电流下,最大电流增益达到320。

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