首页> 外文会议>International Conference on Electroceramics and their Applications, Montreux, Switzerland, 24-27 August 1998 >Ferroelectric strontium bismuth tantalate thin films deposited by metalorganic chemical vapour deposition (MOCVD)
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Ferroelectric strontium bismuth tantalate thin films deposited by metalorganic chemical vapour deposition (MOCVD)

机译:通过金属有机化学气相沉积(MOCVD)沉积的铁电钽酸锶铋薄膜

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摘要

Thin films of Sr_(1-x)Bi_(2+x)Ta_2O_9 (SBT) have been deposited by metalorganic chemical vapor deposition (MOCVD) on 150 mm Si wafers with Pt/Ti electrodes. The choice of Bi precursor significantly affects the process; film homogeneity is significantly improved when using alpha beta -diketonate Bi precursor in combination with compatible Sr and Ta precursors. A highly repeatable proces has been developed, with good run-to-run composition and thickness control. Effects of Bi volatility have been investigated in annealing experiments that show the onset of Bi loss at approx 570 deg C at reduced pressure (1-10 Torr). Film properties relevant to integrated ferroelectric random access (Fe RAMS) memories have also been characterized. Remenant polarizations (2P_r) up to 24 mu C cm~(-2) have been obtained at 5 V, with 90
机译:Sr_(1-x)Bi_(2 + x)Ta_2O_9(SBT)薄膜已通过金属有机化学气相沉积(MOCVD)沉积在具有Pt / Ti电极的150毫米Si晶圆上。 Bi前体的选择会显着影响该过程。当将α-β-二酮酸铋前体与相容的Sr和Ta前体组合使用时,薄膜的均质性得到显着改善。已经开发出了具有高度可重复性的过程,具有良好的连续运行组成和厚度控制。 Bi挥发性的影响已在退火实验中进行了研究,退火实验表明在大约570摄氏度的减压下(1-10 Torr)Bi的损失开始。与集成铁电随机存取(Fe RAMS)存储器相关的薄膜特性也已被表征。在5 V和90 V下获得了高达24μC cm〜(-2)的剩余极化(2P_r)

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