Materials and Processes for High Speed Printing for Electronic Components

摘要

Printing methods already familiar to the graphic arts industry can be used to apply carefully designed electronic materials at high speed and low cost. Processes such as offset lithography, gravure, flexography and inkjet are being used to manufacture electronic components. Each method has advantages and disadvantages in terms of process capabilities, and differences in material properties required to run. For both historical and pragmatic reasons, the patterning and layering capability of high-speed printing has been limited to suit the resolving power of the human eye. Experiments have been conducted to benchmark existing capability of these processes and materials on flexible substrates. Such experiments will provide a foundation for exploring the viability of existing printing infrastructure for the mass production of commercial products. In addition, improvements in these electronic materials and the mechanics of printing processes may provide significant advancement of future application capability.