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Materials and Processes for High Speed Printing for Electronic Components

机译:用于电子元件的高速印刷材料和工艺

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Printing methods already familiar to the graphic arts industry can be used to apply carefully designed electronic materials at high speed and low cost. Processes such as offset lithography, gravure, flexography and inkjet are being used to manufacture electronic components. Each method has advantages and disadvantages in terms of process capabilities, and differences in material properties required to run. For both historical and pragmatic reasons, the patterning and layering capability of high-speed printing has been limited to suit the resolving power of the human eye. Experiments have been conducted to benchmark existing capability of these processes and materials on flexible substrates. Such experiments will provide a foundation for exploring the viability of existing printing infrastructure for the mass production of commercial products. In addition, improvements in these electronic materials and the mechanics of printing processes may provide significant advancement of future application capability.
机译:图形艺术行业已经熟悉的印刷方法可用于高速和低成本仔细设计的电子材料。诸如偏移光刻,凹版印刷,柔性射图和喷墨胶片等过程用于制造电子元件。每个方法在工艺能力方面具有优缺点,并且需要运行所需的材料特性的差异。出于历史和语用原因,高速印刷的图案化和分层能力受到限于适合人眼的分辨率。已经进行了实验,以基于这些方法和柔性基板上的材料的现有能力。这些实验将为探索现有的印刷基础设施为大规模生产商业产品的生存来提供基础。此外,这些电子材料的改进和印刷过程的机制可以提供未来应用能力的显着进步。

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