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Characterizing Diamond Disc Substrate Loss and Diamond Micro-Wear in Copper CMP

机译:表征铜CMP中的金刚石盘基片损耗和金刚石微磨损

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摘要

It is well known that pad conditioning is necessary to prevent removal rate decay in CMP. However, depending on process kinematics, ionic strength of the slurry, oxidizer concentration, concentration and nature of slurry abrasive particles, disc down force, and design and materials of construction of the diamond and the substrate on which the diamonds are mounted, chemical or abrasive wear of the conditioner itself may be sufficient to require replacement of the disc within ten or twenty hours. In studying diamond wear, it is important to note that: 1. Extended use of diamond conditioners causes minimal diamond wear (known as 'micro-wear') which can be quantified through white light interferometry [Ref. 1].
机译:众所周知,为了防止CMP的去除速率下降,必须进行焊盘调节。但是,取决于工艺运动学,浆液的离子强度,氧化剂浓度,浆液磨料颗粒的浓度和性质,圆盘向下压力以及金刚石和其上安装金刚石的基材,化学或磨料的设计和构造材料调节器本身的磨损可能足以要求在十或二十小时内更换光盘。在研究钻石磨损时,重要的是要注意:1.钻石调理剂的长期使用可以使钻石的磨损最小(称为“微磨损”),可以通过白光干涉测量法对其进行定量[参考资料]。 1]。

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