DEFECTIVITY IN CHEMICAL MECHANICAL PLANARIZATION: A MULTISCALE APPROACH

摘要

A multi-scale model encompassing pad response and slurry evolution is developed to predict scratch propensity in a CMP process. The pad response delineates the interplay between the local particle level deformation and the cell level bending of the pad. The slurry evolves in the diffusion limited agglomeration (DLA) or reaction limited agglomeration (RLA) regime. Various nano-scale slurry properties significantly influence the spatial and temporal modulation of the material removal rate (MRR) and scratch generation characteristics. The model predictions are first validated against experimental observations. A parametric study is then undertaken. Such physically based models can be utilized to optimize slurry and pad designs to control the depth of generated scratches as well as their frequency per unit area.