Monitoring of Polymer Removal Process for Copper Interconnect

摘要

Transition of interconnect technology to copper elevated challenges for polymer removal. Electrolyte has to provide efficient removal of organic material while preserving Cu surface with controlled regrowth of copper oxide. Spectroscopy in combination with electrochemical method can provide comprehensive characterization of electrolyte for concentration of major components (H_2O_2, H_2O, organic, pH). In addition, local electrochemical analysis provides information on copper oxide removal/regrowth.