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Fracture behavior of a brittle thin film on an elastic substrate under residual stress and uniaxial tensile loading

机译:残余应力和单轴拉伸载荷作用下弹性基材上脆性薄膜的断裂行为

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The fracture behavior of a brittle thin film on an elastic substrate under residual stress and uniaxial tensile loading is investigated.It is assumed that the residual stress in the thin film is not large enough to cause the thin film to fracture.Using a mechanical model presented in this work, the analytical solutions for the distribution laws of the tensile stress developed in the thin film, the shear stress developed along the interface and the relationship between the crack density of the thin film and the applied strain of the substrate can be obtained.The results presented in this work can provide a new analytic solution to the interfacial shear stress for characterizing the interfacial shear strength of the thin film/substrate system when the uniaxial tensile test is adopted to evaluate the mechanical properties of the thin film/substrate system.
机译:研究了在残余应力和单轴拉伸载荷作用下弹性基底上脆性薄膜的断裂行为,假设薄膜中的残余应力不足以导致薄膜断裂,并使用力学模型在这项工作中,可以得到薄膜中产生的拉应力,沿界面产生的切应力以及薄膜的裂纹密度与基体施加应变之间的关系的分布规律的解析解。当采用单轴拉伸试验评估薄膜/基底系统的力学性能时,这项工作提供的结果可以为界面剪切应力提供一个新的解析解,以表征薄膜/基底系统的界面剪切强度。

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