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Third generation and multi-color IRFPA developments: a unique approach based on DEFIR

机译:第三代和多色IRFPA开发:基于DEFIR的独特方法

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For preparing future military and industrial needs, SOFRADIR is working with CEA-LETI/LIR in the frame of DEFIR (Design of Excellence for the Future of InfraRed), on the third generation R&D mainly based on HgCdTe (MCT) material growth by Molecular Beam Epitaxy (MBE). Based on MCT grown by MBE, large wafers (4 inches and more) are available on Germanium in France and on Silicon in the USA. MBE process on alternative materials like Germanium, are in position to replace CZT homo-substrates and to compete with other material candidates. This enables very larger wafer size (4" and more) with a well-mastered thickness of the sensitive thin film deposition leading to very low cost 2D MCT arrays. In addition multi spectral arrays including advanced photodiode technologies are developed thanks to the MBE process. Therefore third generation IR detector studies in progress at DEFIR concern very large format sizes including small pixel pitch and high performance and mainly multi spectral and multi-color FPAs. New development results are presented and future trends are discussed.
机译:为了满足未来的军事和工业需求,SOFRADIR在DEFIR(红外未来的卓越设计)框架内与CEA-LETI / LIR合作,进行第三代研发,主要基于分子束对HgCdTe(MCT)的材料生长外延(MBE)。基于MBE生产的MCT,法国的锗和美国的硅都可以买到大晶片(4英寸或更大)。 MBE工艺可替代锗等替代材料,可替代CZT均质基材并与其他候选材料竞争。这样可以很好地控制敏感薄膜的厚度,从而实现更大的晶圆尺寸(4英寸或更大),从而实现了成本极低的2D MCT阵列。此外,借助MBE工艺,还开发了包括先进光电二极管技术在内的多光谱阵列。因此,DEFIR正在进行的第三代红外探测器的研究涉及非常大的格式尺寸,包括小像素间距和高性能,主要是多光谱和多色FPA,提出了新的开发结果并讨论了未来的趋势。

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