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Annealing behaviour of the vanadium oxide films prepared by modified ion beam enhanced deposition

机译:改性离子束增强沉积法制备钒氧化物薄膜的退火行为

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Different annealing conditions were adopted to anneal the vanadium oxide films prepared by modified Ion Beam Enhanced Deposition (IBED) method. An X-Ray Diffraction (XRD) was used to analyze the orientation of the IBED films and the resistance was tested with temperature change to measure the Temperature Coefficient of Resistance (TCR). Experiments indicated that there existed a critical temperature for crystallization of VO_2, which changed with the different deposition conditions of the IBED method. It is very difficult to obtain VO_2 structure if the annealing temperature was lower than the critical temperature. If the temperature is much higher than the critical temperature or annealing tune is too long, the valence of vanadium in VO_2 film will easily reduce from 4 to low value. The TCR of the IBED VO_2 polycrystalline films annealed in appropriate condition could reach higher than 4%/K.
机译:采用不同的退火条件对通过改进的离子束增强沉积(IBED)方法制备的氧化钒薄膜进行退火。使用X射线衍射(XRD)分析IBED膜的取向,并通过温度变化测试电阻,以测量电阻的温度系数(TCR)。实验表明,存在VO_2结晶的临界温度,该温度随IBED方法沉积条件的不同而变化。如果退火温度低于临界温度,则很难获得VO_2结构。如果温度远高于临界温度或退火时间太长,VO_2薄膜中钒的化合价将很容易从4降至低值。在适当条件下退火的IBED VO_2多晶薄膜的TCR可以达到高于4%/ K。

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