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Development of a robust 50V 0.35 μm based Smart Power Technology using trench isolation

机译:利用沟槽隔离开发基于鲁棒的50V 0.35μm的智能电源技术

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This paper describes a new 0.35 μm CMOS based smart power technology. The so-called I3T50 technology belongs to a series of intelligent interface technologies developed within AMI Semiconductor over the past years. This technology is suitable for applications up to 50 V, such as automotive, peripheral and consumer applications. Trench isolation is used to isolate the devices, substantially reducing the isolation area. The set of devices available within this technology consists of n-type and p-type CMOS and DMOS devices, bipolar transistors, a high voltage floating diode, passive components, OTP memory and a set of ESD protection structures. In the future, the technology will be extended also with a modular embedded flash memory.
机译:本文介绍了一种新的基于0.35μmCMOS的智能电源技术。所谓的I3T50技术属于AMI半导体在过去几年中开发的一系列智能接口技术。该技术适用于高达50 V的应用,例如汽车,外围设备和消费类应用。沟槽隔离用于隔离设备,从而大大减小了隔离面积。该技术中可用的一组器件包括n型和p型CMOS和DMOS器件,双极晶体管,高压浮动二极管,无源组件,OTP存储器和一组ESD保护结构。将来,该技术还将通过模块化嵌入式闪存进行扩展。

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