System integration: thermal aspects of chip utilization of power devices

摘要

This paper presents two sides of combined silicon utilization - power device and control chip. For these purpose investigations of the transient chip temperature of a multichip power module are presented. The calculation of chip temperature and power losses occurs on-line in a microcontroller. Advanced practical results achieved in a 3-phase inverter application are shown at different loads. In addition, required controller resources are discussed for the control unit.