Automotive Semiconductor Sensor and Packaging Technology

摘要

The recent rapid progress of car electronics has contributed to diffusion of sophisticated vehicle control systems and to enhance the basic performance of vehicles. One of the main constituent parts is the automotive semiconductor sensor. Along with development of car electronics,many mechanical sensors have been replaced by such semiconductor sensors,and pressure sensors and accelerometer sensors are the representative examples. Those sensors gained their popularity against the applications in a harsh environment in vehicles because of improvement of processing technology enabling miniaturization and weight-saving of semiconductor silicon as required for automotive applications and attainment of the exclusive packaging technologies,adapted for a various operating conditions,enabling sufficient environmental resistance and reliability. In this paper,pressure sensor and accelerometer sensor are given as examples to describe DENSO representative semiconductor products.