Determining the Effects of Package Parasitics on SI and EMC Performance

摘要

Signal Integrity and EMC problems are significantly affected by integrated circuit package parasitics. Such effects can be especially problematical for cases where devices undergo a die shrink in the same package. A simple method of determining the effects of package parasitics for a broad class of chip packages is described. Once significant noise due to package parasitics is identified,it may not actually result in a problem. A method is presented to determine when the observed noise will actually become a problem. Examples of problems that have occurred and how to avoid them are presented. New insight will also be provided on die to heat sink coupling of high frequency signals.