Silicon Technology Development and the Impact on ESD Design with Advanced IC Packages

摘要

This paper reviews the technology and circuit trends that are making ESD design a difficult task,followed by identification of the specific package development issues that further restrict the ESD design. The focus will be on the IC package historic roadmap and the general impact on ESD. These issues will be tied together in discussing an ESD roadmap that comprehends realistic ESD specification goals for the near future with the purpose to challenge the package development community in important technical developments needed for future ESD design.