Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead Free Soldering and Gold Wire Bonding

机译：用于无铅焊接和金线键合的ENEPIG镀层中合适的钯金厚度的研究

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A study was conducted to determine the reliability of lead free solder joints and wire bonds when ENEPIG is used as the surface finish. Different palladium and gold thicknesses were evaluated and their subsequent effects on the composition of the inter-metallic compound (IMC) and the wire bond strength were determined. Optimum thicknesess for lead free soldering and wire bonding were identified. A thickness range were both activities can be completed with high reliability was determined. The IMC was studied for both Sn-3.5Ag and for Sn-3.0Ag-0.5Cu (SAC305) solder alloys, in an attempt to explain the difference in solder joint reliability between the two lead free solders.

机译：进行了一项研究，以确定将ENEPIG用作表面光洁度时无铅焊点和引线键合的可靠性。评估了不同的钯金厚度和金厚度，并确定了它们对金属间化合物（IMC）的成分和引线键合强度的后续影响。确定了无铅焊接和引线键合的最佳厚度。确定了可以高可靠性完成两个活动的厚度范围。研究了IMC用于Sn-3.5Ag和Sn-3.0Ag-0.5Cu（SAC305）焊料合金，试图解释两种无铅焊料在焊点可靠性方面的差异。

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来源
《IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain》|2008年|p.000924-000930|共7页
会议地点 Providence RI(US);Providence RI(US)
作者
Yukinori Oda; Masayuki Kiso; Seigo Kurosaka; Akira Okada; Kota Kitajima; Shigeo Hashimoto;
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作者单位

C. Uyemura and Corporation Ltd, Central Research Laboratory, Osaka, Japan, and George Milad, Don Gudeczauskas UIC Technical Center, Southington, Connecticut, USA;

rnC. Uyemura and Corporation Ltd, Central Research Laboratory, Osaka, Japan, and George Milad, Don Gudeczauskas UIC Technical Center, Southington, Connecticut, USA;

rnC. Uyemura and Corporation Ltd, Central Research Laboratory, Osaka, Japan, and George Milad, Don Gudeczauskas UIC Technical Center, Southington, Connecticut, USA;

rnC. Uyemura and Corporation Ltd, Central Research Laboratory, Osaka, Japan, and George Milad, Don Gudeczauskas UIC Technical Center, Southington, Connecticut, USA;

rnC. Uyemura and Corporation Ltd, Central Research Laboratory, Osaka, Japan, and George Milad, Don Gudeczauskas UIC Technical Center, Southington,;

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会议组织
原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
关键词
ENEPIG; lead free solder; gold wire bonding; intermetallic;

机译：ENEPIG;无铅焊料；金线键合；金属间的;

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1. Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead-Free Soldering and Gold Wire Bonding [J] . Printed Circuit Design . 2009,第4期

机译：用于无铅焊接和金线焊接的ENEPIG镀层中合适的钯金厚度的研究
2. Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish [J] . YOUNG MIN KIM, JIN-YOUNG PARK, YOUNG-HO KIM Journal of Electronic Materials . 2012,第4期

机译：Pd厚度对Sn-3.0Ag-0.5Cu焊料与化学镍/化学钯/浸金（ENEPIG）表面处理之间的界面反应和焊缝剪切强度的影响
3. EPIG Nickel-Free PCB Coating Debuts at Superior Processing Finish is Gold Wire Bondable, Solderable [J] . Printed Circuit Design & Manufacture . 2017,第2期

机译：EPIG无镍PCB涂层首次亮相具有金线可焊性和可焊性
4. Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead Free Soldering and Gold Wire Bonding [C] . International symposium on microelectronics . 2008

机译：对铅焊接铅矿床合适钯和金厚度的研究
5. Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging. [D] . Kim, Patrick Gu-Ho. 1998

机译：含铅和无铅焊料合金在电子包装中的金，钯，镍箔，引线框架和凸块下的薄膜金属上的润湿行为和界面反应。
6. Palladium nanoparticles entrapped in a self-supporting nanoporous gold wire as sensitive dopamine biosensor [O] . Xin Yi, Yuxuan Wu, Guoxin Tan, -1

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7. Reaction Between Thin Gold Wires and Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part B. The "Axial Reaction" of Gold Wires Solder To PbSnIn Solder Mounds, Its Effect On Electrical Resistance And Physical Structure [O] . Siekhaus, W J 2011

机译：薄金线与pb-sn-In焊料之间的反应（37.5％，37.5％，25％），B部分。金线焊接到pbsnIn焊料堆的“轴向反应”，其对电阻和物理结构的影响

Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead Free Soldering and Gold Wire Bonding

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