POLYIMIDE-METAL LAMINATE TO PROVIDE EXCELLENT HEAT RESISTANCE AND LOW TEMPERATURE ADHESION, AND TO HARDLY GENERATE BLISTER WHEN FORMING GOLD-TIN BOND OR GOLD-GOLD BOND USED FOR LEAD-FREE SOLDERING AND COF PACKAGING

摘要

PURPOSE: A polyimide-metal laminate is provided to improve heat resistance and to hardly generate blisters or pinholes when forming Au-Sn bond or Au-Au bond used for lead-free soldering and chip-on-film(COF) packaging. The laminate also has high adhesion strength without residual voids on the interface between the metal and polyimide. CONSTITUTION: The polyimide-metal laminate comprises: a metal foil layer; and a layer of a resin composition prepared by compounding a bismaleimide compound represented by the following formula 1, in a polyamic acid, a polyimide or a mixture thereof. In the formula 1, m is an integer of 0 or more; each x, which may be same or different, independently represents O, SO2, S, CO, CH2, C(CH3)2, C(CF3)2 or a direct bond; and each R1, which may be same or different, independently represents a hydrogen atom, a halogen atom or a hydrocarbon group, and the substitution position on the benzene ring is independent of each other, wherein the layer of the resin composition is laminated on at least one surface of the metal foil layer.