插头镀金线镀层厚度计算模型研究

摘要

电镀镍金镀层厚度是PCB产品可靠性的关键指标，文章从插头镀金线实际生产需求出发，运用法拉第定律和多元函数进行数学推导，得出一个普遍适用于插头镀金线镀层厚度理论计算模型。在理论计算模型的基础上进行多次试验分别得出电镀镍和电镀金的电流效率，并对实际镀层厚度计算模型的有效性进行重复试验验证。试验结果表明，我们可以得出一个合理的镀层厚度计算模型以指导插头镀金线实际生产。%The electrodeposited coatings thickness of Nickel and Gold is the crucial quality index for PCB manufacture reliability. The paper makes use of Faraday Law and function of many variables to deduce an applicable theoretical calculational model for the electrodeposited coatings thickness of Nickel and Gold about Plug Gold plating line. We carried out so many experiments based on the theoretical calculational model that the current efifciencies about electroplating Nickel and Gold are worked out. We veriifed the effectiveness of the actual calculational model by repeated experiments. The results shows that we can get a logical calculational model to the electrodeposited coatings thickness for Plug Gold plating line in practice.