Corrosion-Resistant Anisotropic Conductive Adhesive for Consumer Electronic Applications

摘要

Resin-based interconnection materials for flip die technologies have been widely used in manufacturing electronic devices such as flat panel displays and other semiconductor package modules inform of(die)or chip on glass (COG) and (die) or chip on flex (COF)for the last thirty years. Traditionally, these applications used anisotropic conductive film (ACF) which enables lead(Pb)-free assembly, but requires additional handling and laminating steps. The proliferation of flip die technology is evident in many consumer electronic applications such as RFID and mobile phones, where the high throughput rate and lower processing temperature is critical. For many of these emerging applications the traditional anisotropic conductive adhesive (ACA) (mainly ACF) may not be suitable with regard to cure speed and the compatibility with non noble metallization. Customer market studies show there is a requirement for a low temperature, snap cure anisotropic conductive paste (ACP) which can be dispensed, jetted or printed on the substrate prior to the assembly.rnIn this paper, a novel anisotropic conductive paste (ACP) which was formulated and optimized through mixture DOE methods will be discussed. The paper will also analyze the effects of different bonding parameters, such as temperature, pressure, and curing time studied and optimized through factorial DOE methods. The paper will present details on the work life jettability, stencil and screen printing characteristics of this novel ACP. The contact resistance and adhesion strength stability of the ACP to non-noble metal (Cu, Al) in 85℃/85% RH for greater than 250 hours and 500 hours thermal shock cycles will be discussed.