Freescale Semiconductor, Inc. 6501 William Cannon Drive, Austin TX 78735 Tu.Anh.Tran@freescale.com;
rnFreescale Semiconductor, Inc. 1300 North Alma School Road, Chandler, Arizona 85224 David.Dorinski@freescale.com;
rnFreescale Semiconductor, Inc. 1300 North Alma School Road, Chandler, Arizona 85224 Simon.Gonzales@freescale.com;
rnFreescale Semiconductor, Inc. 1300 North Alma School Road, Chandler, Arizona 85224 Phong.Vu@freescale.com;
rnFreescale Semiconductor, Inc. 1300 North Alma School Road, Chandler, Arizona 85224 Ron.Weberg@freescale.com;
low-k dielectric; TE-PBGA; ILD delamination; dicing; die attach fillet height; mold compound filler;
机译:使用CFD工具对倒装芯片塑料BGA封装进行热增强的研究
机译:硅中介层上模制多芯片的热增强型2.5D封装的研究
机译:微电子包装中的热机械增强型高性能有机硅凝胶和弹性体密封剂
机译:克服热增强BGA包装用Low-K硅克服挑战
机译:电子封装的热变形以及封装对铜/低k互连结构的可靠性的影响。
机译:具有增强的导热性能的三维异质结构还原氧化石墨烯-六方氮化硼堆叠材料
机译:热稳定的低K硼嗪 - 硅聚合物