The Case of Failure Analysis of the PCBA Wire Corrosion under High Reliability Requirements

摘要

The wire breakage of a no-cleaning process PCBA occurs at the beginning of the application. Through visual inspection, cross-section, SEM & EDS, and ion chromatography analysis, it was found that the high content of ions (bromide ion) on the surface of the solder source side caused corrosion and fracture of the conductors of wave soldering surface, this article also analyzes the source of bromide ion.