Study on Thermoelectric Conversion and Conjugate Heat Transfer for PCBA by Finite Element Analysis

摘要

In this study, the simulation parameters obtained from experiment were used to verify the heat transfer parameters of graphene thermal interface materials (TIMs) on a single chip. The optical and power parameters of the unfilled high-power commercial LED lighting are measured by using integrating sphere and power analyzer in order to establish a fast and accurate simulation mode. The heat dissipation effects of composite and multilayer graphene-made TIMs in a closed and compact space are investigated using the heat-radiating materials with different thermal emissivity. By applying the established simulation mode, the simulation error in the main heating source of the light-emitting diode is between 3% and 5%. The use of composite graphene-made TIMs in the LED device can effectively reduce the operating temperature of the PCBA in a closed and compact space. The experimental result of temperature drop of the chip is up to 6.8 ° C and the simulation result shows the temperature drop is up to 3.9°C.