Automated Dual-probing System for Wafer-level Testing Based on the Integration of Visual Identification and Laser Sensing

摘要

This study develops an automated wafer-level testing system, using visual and laser as the sensing devices, which can be the platform of MEMS measurement at wafer level. The proposed system involves the development of human-machine interface and precisely positioning control, which includes camera module for visual identification, motorized micro positioners, laser sensors for probe positioning automated, and wafer movable stage for the wafer positioning.