Simple alignment technique for molding and transfer of 3D PDMS structure using the mechanical alignment jig

摘要

Simple alignment technique for the purpose of PDMS molding and transfer is proposed. In order to realize suggested technique, specially designed mechanical jig is devised. This jig helps the mechanical alignment and the clamping of the same-sized wafers. Silicon-on-glass wafer is used as a carrier substrate of the thin PDMS structure. 3D PDMS structure for the cap of sensor has been molded and transferred to the sensor using the jig. Though principle and procedure of alignment is very simple, relatively high alignment precision of 10µm has been achieved. All caps of the sensor chips have survived without peeling during dicing process.