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The Quality of Thin Gate Oxide was Improved by Plasma Treatment and Low Temperature Annealing

机译:通过等离子体处理和低温退火提高了薄栅氧化物的质量

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In this paper, we proposed a novel method to improve the quality of thin oxide films (~20nm). After deposition of oxide films, the oxide films were treated with various kinds of plasma. Beside that, the sample with plasma treatment was annealed at various temperature and time. The I-V and C-V characteristics of oxide films with various plasma treatments and post annealing condition were investigated. The leakage current of thin oxide could be reduced by O2 plasma treatment and post annealing process.
机译:在本文中,我们提出了一种新的方法来提高氧化薄膜(〜20nm)的质量。在沉积氧化膜之后,用各种等离子体处理氧化膜。除此之外,在不同的温度和时间对经过等离子体处理的样品进行退火。研究了各种等离子体处理和后退火条件下氧化膜的I-V和C-V特性。可以通过O2等离子体处理和后退火工艺来减少薄氧化物的泄漏电流。

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