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MEMS-based infrared detector for body thermometer

机译:基于MEMS的人体温度计红外探测器

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Infrared detectors have many application fields. One of those, MEMS-based thermopile is attractive for many low-cost commercial and industrial applications, mainly because it does not require cooling for operation and the process technologies are relatively simple. The MEMS thermopile fabricated on a silicon nitride microbridge structure was proposed. Using microbridge rather conventional membrane makes it possible to fabricate much smaller micro thermopile and to reduce heat loss because of small contact area at silicon rim. The bridge material is only composed of Si_3N_4. The thermocouple was used a poly-Si and an aluminum. The characteristic of electromotive force (EMF) generation was evaluated for various patterns at hot junction. Aluminum thermocouple shape on bridge structure was designed two patterns. One was a square shape and the other shape was a hollow square. The output voltage of hollow square-type electrode was increased in compared with square-type electrode from 3.03uV/℃ to 4.609uV/℃ at body temperature (37℃). With the same membrane dimensions and the same overall thickness of the chip a thermopile on microbridge is almost 53% smaller a conventional thermopile chip.
机译:红外探测器具有许多应用领域。其中之一,基于MEMS的热电堆吸引了许多低成本的商业和工业应用,这主要是因为它不需要冷却来运行,而且工艺技术相对简单。提出了在氮化硅微桥结构上制造的MEMS热电堆。使用微桥而不是传统的膜,可以制造出更小的微型热电堆,并由于硅边缘的接触面积小而减少了热损失。桥接材料仅由Si_3N_4组成。热电偶使用了多晶硅和铝。对热结处的各种模式评估了电动势(EMF)的产生特性。铝热电偶在桥形结构上设计了两种模式。一个是正​​方形,另一个是空心正方形。在体温(37℃)下,空心方形电极的输出电压比方形电极的输出电压从3.03uV /℃增加到4.609uV /℃。在相同的膜片尺寸和相同的芯片总厚度下,微桥上的热电堆几乎比传统热电堆芯片小53%。

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