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Analysis of Contaminated Oxide-Silicon Interfaces

机译:污染的氧化物-硅界面的分析

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Methods for the analysis of the oxide-silicon interface were compared for their ability to reveal metal segregation at the interface and organic contamination. The impact of these contaminations on surface recombination velocity measurements, on capacitance vs. voltage, conductance vs. voltage and capacitance vs. time measurements and on MOS-DLTS spectra was studied. Niobium-contaminated wafers were used as an example of metal surface segregation, because it was previously shown that niobium is prone to surface segregation. Interface state density measurements obtained by the conductance method showed a limited impact of niobium implantation. Vice versa significant effects were found in MOS-DLTS spectra. For what concerns organic contamination, MOS-DLTS showed the most significant effects from the point-of-view of the intrinsic properties of the silicon oxide - silicon interface, and GOI tests demonstrate a clear impact of the organic contamination on MOS capacitors oxide breakdown events.
机译:比较了分析氧化物-硅界面的方法,它们显示出界面处的金属偏析和有机污染物的能力。研究了这些污染物对表面复合速度测量,电容与电压,电导与电压以及电容与时间的关系以及MOS-DLTS光谱的影响。铌污染的晶片被用作金属表面偏析的一个例子,因为以前已经证明铌易于表面偏析。通过电导方法获得的界面态密度测量结果显示,铌注入的影响有限。反之,在MOS-DLTS光谱中发现了明显的影响。对于有机污染物,从氧化硅-硅界面的固有特性的角度来看,MOS-DLTS表现出最显着的影响,GOI测试表明有机污染物对MOS电容器的氧化击穿事件有明显影响。

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