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Analysis of Contaminated Oxide-Silicon Interfaces

机译:污染氧化硅界面分析

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摘要

Methods for the analysis of the oxide-silicon interface were compared for their ability to reveal metal segregation at the interface and organic contamination. The impact of these contaminations on surface recombination velocity measurements, on capacitance vs. voltage, conductance vs. voltage and capacitance vs. time measurements and on MOS-DLTS spectra was studied. Niobium-contaminated wafers were used as an example of metal surface segregation, because it was previously shown that niobium is prone to surface segregation. Interface state density measurements obtained by the conductance method showed a limited impact of niobium implantation. Vice versa significant effects were found in MOS-DLTS spectra. For what concerns organic contamination, MOS-DLTS showed the most significant effects from the point-of-view of the intrinsic properties of the silicon oxide - silicon interface, and GOI tests demonstrate a clear impact of the organic contamination on MOS capacitors oxide breakdown events.
机译:比较氧化硅界面分析的方法,以揭示界面和有机污染的金属偏析的能力。研究了这些污染对表面重组速度测量的影响,研究了电容与电压,电导率与电容与电容与MOS-DLTS光谱的电压和电容Vs。使用铌污染的晶片作为金属表面偏析的一个例子,因为它之前示出了铌易于表面偏析。通过电导方法获得的界面状态密度测量显示铌植入的有限影响。 MOS-DLTS光谱中发现了反之亦然的显着效果。对于有机污染问题,MOS-DLTS从氧化硅界面的内在性质的视点显示出最显着的影响,GOI测试表明有机污染对MOS电容器氧化物分解事件的显着影响。

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