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Studies of Relaxation Processes and Basal Plane Dislocations in CVD Grown Homoepitaxial Layers of 4H-SiC

机译:CVD生长的4H-SiC同质外延层中弛豫过程和基面位错的研究

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Dislocation behavior during homo-epitaxy of 4H-SiC on offcut substrates by Chemical Vapor Deposition (CVD) has been studied using Synchrotron X-ray Topography and KOH etching. Studies carried out before and after epilayer growth have revealed that, in some cases, short, edge oriented segments of basal plane dislocation (BPD) inside the substrate can be drawn towards the interface producing screw oriented segments intersecting the growth surface. In other cases, BPD half-loops attached to the substrate surface are forced to glide into the epilayer producing similar screw oriented surface intersections. These screw segments subsequently produce interfacial dislocations (IDs) and half-loop arrays (HLAs). We also report on the formation of IDs and HLAs generated from: (a) surface sources of BPDs; (b) micropipes; (c) 3C inclusions; and (d) substrate/epilayer interface scratches. The HLAs are known to result in Shockley fault expansion within the epilayer which results in forward voltage drop and device failure.
机译:已经使用同步加速器X射线形貌和KOH蚀刻研究了化学气相沉积(CVD)在4H-SiC均质外切衬底上的位错行为。在外延层生长之前和之后进行的研究表明,在某些情况下,可以将基底内基面位错(BPD)的短而边缘定向的节段拉向界面,从而产生与生长表面相交的螺旋定向节段。在其他情况下,迫使附着在基材表面的BPD半环滑入外延层,从而产生类似的螺钉定向表面交叉点。这些螺钉段随后产生界面错位(ID)和半环阵列(HLA)。我们还报告了由以下因素产生的ID和HLA的形成:(a)BPD的表面来源; (b)微型管; (c)3C夹杂物; (d)基板/外延层界面刮擦。已知HLA会导致外延层内的Shockley故障扩展,从而导致正向电压降和设备故障。

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    Department of Materials Sci. and Engr., Stony Brook University, Stony Brook, New York, 11794, USA;

    Department of Materials Sci. and Engr., Stony Brook University, Stony Brook, New York, 11794, USA;

    Department of Materials Sci. and Engr., Stony Brook University, Stony Brook, New York, 11794, USA;

    Department of Materials Sci. and Engr., Stony Brook University, Stony Brook, New York, 11794, USA;

    Department of Materials Sci. and Engr., Stony Brook University, Stony Brook, New York, 11794, USA;

    Department of Materials Sci. and Engr., Stony Brook University, Stony Brook, New York, 11794, USA;

    Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, USA;

    Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, USA;

    Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, USA;

    Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, USA;

    Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, USA;

    Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, USA;

    Dow Corning Compound Semiconductor Solutions, Midland, Michigan, 48686, USA;

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