首页> 外文会议>Future of Electron Devices, Kansai (IMFEDK), 2012 IEEE International Meeting for >Photoluminescence study on recrystallization of ultra-shallow junction towards in-line measurements
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Photoluminescence study on recrystallization of ultra-shallow junction towards in-line measurements

机译:面向在线测量的超浅结重结晶的光致发光研究

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摘要

Defect formation and annihilation in ultra-shallow junction (USJ) before and after rapid thermal annealing (RTA) are characterized by multiwavelength-excited photoluminescence (PL) technique with probing depths of excitation light in a range between 1.5 and 45 mm clearly identifies defects formed in the deep region beneath the shallow implanted layers. Compared with the results obtained by deep-level transient spectroscopy (DLTS), PL measurements at room temperature enable us to characterized defects of USJ layers with density in the density in the order of 1012 cm−3 or less, nondestructively on an in-line basis.
机译:快速热退火(RTA)前后超浅结(USJ)中的缺陷形成和formation灭的特征在于多波长激发光致发光(PL)技术,激发光的探测深度在1.5到45 mm之间,可以清楚地识别出形成的缺陷在浅埋层下方的深层区域。与通过深层瞬态光谱法(DLTS)获得的结果相比,室温下的PL测量使我们能够表征密度在10 12 cm 的USJ层缺陷-3 或更少,基于行内无损检测。

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